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Three Station Diamond Single Line Cutting Machine SiC Sapphire Ceramics

Three Station Diamond Single Line Cutting Machine SiC Sapphire Ceramics

ब्रांड नाम: ZMSH
मॉडल संख्या: Diamond Wire Saw Cutting Machine
एमओक्यू: 1
कीमत: by case
पैकेजिंग विवरण: custom cartons
भुगतान की शर्तें: T/T
विस्तृत जानकारी
Place of Origin:
China
Maximum Workpiece Size:
600 * 600mm
Cutting method:
The material is stationary, and the diamond wire sways and descends
Wire Running Speed:
1000 m/min (MIX)
Diamond Wire Diameter:
0.2 – 0.48 mm
Cutting Thickness Range:
0-600mm
Cutting Accuracy:
0.01mm
Supply Ability:
By case
प्रमुखता देना:

Single Line Diamond Cutting Machine

,

Three Station Ceramics Cutting Machine

उत्पाद का वर्णन

Three Station Diamond Single Line Cutting Machine SiC Sapphire Ceramics

Overview of Three station diamond single line cutting machine 

 

This high-performance Three-Station Diamond Single Wire Cutting Machine is designed specifically for square cutting of hard and brittle materials. Featuring three independent workstations, it enables simultaneous cutting of three raw material blocks, greatly enhancing productivity and flexibility. The machine is suitable for large-size square substrates of materials such as silicon carbide, sapphire, ceramics, precious metals, quartz, and semiconductors.

Three Station Diamond Single Line Cutting Machine SiC Sapphire Ceramics 0   Three Station Diamond Single Line Cutting Machine SiC Sapphire Ceramics 1

 

Key Features of Three station diamond single line cutting machine

 

 High-Efficiency & Precision Cutting

  • Adopts a stationary material + downward swinging diamond wire cutting method.
  • Fully controlled by a servo motor system, with advanced tension feedback.
  • Cutting speed of diamond wire can reach up to 1000 m/min.
  • Cutting thickness range: 0 mm – 600 mm, adaptable for various production needs.
  • Achieves surface cutting accuracy of 0.01 mm, ensuring high flatness and uniformity.

 

 Multi-Station Design for Batch Processing

  • Three simultaneous workstations for batch cutting and processing.
  • Greatly improves throughput for high-volume manufacturing lines.

 

Wide Material Compatibility

  • Suitable for hard and brittle materials such as:
    • Silicon carbide (SiC)
    • Sapphire
    • Ceramics
    • Precious metals
    • Quartz
    • Semiconductor materials
  • Supports both standard square cutting and non-standard customization.

 

Stable Operation & Low Maintenance

  • All key motion modules—unwinding, rewinding, wire guiding, spindle, tension control, and worktable feeding—are driven by servo motors.
  • Closed-loop feedback for tension control ensures constant tension and avoids wire breakage.
  • Equipped with tension warning system for real-time monitoring.
  • Designed for long-term, high-load operation with minimal downtime and maintenance.

 

High-End Control System

  • Advanced full-servo motor control combined with intelligent algorithms.
  • Automatically adjusts cutting force and speed based on material hardness.
  • Maintains stable cutting even for difficult materials like hard SiC and fragile ceramics.
  • Cutting speed adjustable between 0.01 mm/min – 10 mm/min to ensure high-precision slicing for small and medium components.

 


 

Operation Procedure of Three station diamond single line cutting machine

  1. Replace the wire wheel and prepare for wire winding.

  2. Place and secure raw materials on the workbench.

  3. Close the protective cover and configure parameters via the control panel.

  4. Open the water valve and press the start button.

  5. The diamond wire sways and descends, continuously cutting through the material.

  6. After cutting, close the water valve and unload finished products.

Three Station Diamond Single Line Cutting Machine SiC Sapphire Ceramics 2

 

Construction & Components

  • Core components are precision-cast and the main transmission units are imported to ensure system stability and accuracy.

  • Equipped with UPS from Tianjin Shengong series, providing uninterrupted power support for critical operations.

 

 

Technical Highlights  of Three station diamond single line cutting machine

 

Parameter Item

Specification Value

Model Three station diamond single line cutting machine
Maximum workpiece size 600 * 600mm
Wire running speed 1000 (MIX) m/min
Diamond wire diameter 0.25-0.48mm
Line storage capacity 20km
Cutting thickness range 0-600mm
Cutting accuracy 0.01mm
Vertical lifting stroke 800mm
Cutting method The material is stationary, and the diamond wire sways and descends
Cutting feed speed 0.01-10mm/min (According to the material and thickness)
Water tank 150L
Cutting fluid TJ anti rust high-efficiency cutting fluid
Swing angle ±10°
Swing speed 25°/s
Maximum cutting tension 88.0N (Set minimum unit0.1n)
Cutting depth 200~600mm
Workstation 3
Power supply Three phase five wireAC380V/50Hz
Total power of machine tool ≤32kw
Main motor 1 * 2kw
Wiring motor 1 * 2kw
Workbench swing motor 0.4 * 6kw
Tension control motor 4.4 * 2kw
Wire release and collection motor 5.5 * 2kw
External dimensions (excluding arm box) 4859 * 2190 * 2184mm
External dimensions (including arm box) 4859 * 2190 * 2184mm
Machine weight 3600kg
 
 

 

Why Choose Three station diamond single line cutting machine

 

  •  High-speed cutting
  •  Exceptional precision
  •  Flexible multi-material compatibility
  •  Sturdy, low-maintenance design
  •  Perfect for semiconductor and hard substrate industries

 

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About Us

 

Three Station Diamond Single Line Cutting Machine SiC Sapphire Ceramics 5

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