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Sapphire Wafer 6inch C Axis to M Axis 350um Thickness DSP

Sapphire Wafer 6inch C Axis to M Axis 350um Thickness DSP

ब्रांड नाम: ZMSH
मॉडल संख्या: 6 इंच
एमओक्यू: 10Pieces
पैकेजिंग विवरण: वैक्यूम पैकेज
भुगतान की शर्तें: टी/टी
विस्तृत जानकारी
उत्पत्ति के प्लेस:
चीन
प्रमाणन:
RoHS
व्यास:
6 इंच
मोटाई:
350 ± 15um
बेअदबी:
रा ≤ 0.2एनएम
ताना:
≤ 15um
टीटीवी:
≤ 10um
आकार:
गोल, सपाट, पायदान
खरोंचना/खोदना।:
20/10
पोलिश करना:
डीएसपी या एसएसपी
प्रमुखता देना:

6 इंच के नीलमणि वेफर डीएसपी

,

सी अक्ष से एम अक्ष तक नीलमणि सब्सट्रेट

,

350um मोटाई के नीलमणि वेफर

उत्पाद का वर्णन

Sapphire Wafer 6inch C Axis to M Axis 350um Thickness DSP

 

 

 

Production Description:

Sapphire wafers are single‑crystal substrates grown from high‑purity aluminum oxide (Al₂O₃) via processes such as the Kyropoulos (KY) and Heat Exchanger Method (HEM). Their molecular structure consists of three oxygen atoms and two aluminum atoms covalently bonded in a hexagonal lattice. This structure endows sapphire wafers with a range of superior properties, making them a key material across multiple high‑precision and cutting‑edge fields.

 

 

Product Parameters:

Diameter: 6inch or 150±0.1mm
Thickness: 350±15um; 500 ± 15 um; 1000±15um
Roughness: Ra ≤ 0.2 nm
Warp: ≤ 15um
TTV: ≤ 10um
Polish: DSP (Double Side Polished); SSP(Single Side Polished)
Shape: Round, Flat, Notch
Wafer Orientation: C Axis to M Axis
Edge Form: 45°, C shape
Material: Sapphire
Remarks:

All specifications above can be customized upon your request.

 

Product Pictures:

Sapphire Wafer 6inch C Axis to M Axis 350um Thickness DSP 0

 

 

Product Highlights:

 

* Sapphire wafers are with common crystallographic orientations include C‑plane (0001), A‑plane (11‑20), and R‑plane (1‑102); the choice of orientation tailors optical, mechanical, and epitaxial behavior for specific devices.

 

* Typical optical transmission spans the near‑UV to mid‑infrared (approximately 0.19–5.5 μm), with high transparency in the 0.3–5 μm range, supporting applications in optics and optoelectronics.

 

* Mechanical and thermal properties of sapphire wafers include a Mohs hardness of 9, high strength and wear resistance, and a melting point ~2050°C, enabling performance under extreme environments.

 

* Chemical stability of sapphire wafers is excellent—resistant to most acids and alkalis—with notable attack only by HF, phosphoric acid, and molten KOH at elevated temperatures.

 

* Representative applications of sapphire wafers: LED substrates (GaN on sapphire), infrared and laser windows, optical components, and wear‑resistant covers in consumer electronics.

 

 

Related Product Recommendation:

 

2inch Spphire Wafer  C Axis DSP:

Sapphire Wafer 6inch C Axis to M Axis 350um Thickness DSP 1

 

Q&A:

 

Q: What is a sapphire wafer?

 

A: A sapphire wafer is a circular thin slice made of sapphire material, which is widely used in the manufacturing of semiconductors and optical devices.

 

Q: What size are sapphire wafers?

 

A: 2inch, 3inch, 4inch, 6inch, 8inch, 12inch.

 

Q: How to cut a sapphire wafer?

 

A: Cutting a sapphire wafer requires specialized methods due to its extreme hardness (9 on the Mohs scale, second only to diamond) and brittleness. The core approach relies on abrasive-based or laser-based techniques to achieve precise, low-damage cuts.