SiC / नीलम / अति-कठोर भंगुर सामग्री के लिए मल्टी-वायर डायमंड आरी प्रणाली

अन्य वीडियो
August 18, 2025
वीडियो विवरण:
Discover the Multi-Wire Diamond Sawing System, designed for precision slicing of ultra-hard materials like SiC, sapphire, and GaN. This advanced machine boosts efficiency with high-throughput cutting, ensuring superior surface quality and dimensional accuracy for semiconductor, photovoltaic, and LED industries.
संबंधित वीडियो